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PATENTS AUTHORED or CO-AUTHORED by Laurence D.
Schultz |
Patent
Number |
Title |
|
5,011,580 |
Method of reworking an electrical multilayer interconnect |
|
5,036,015 |
Method of endpoint detection during chemical/mechanical planarization
of semiconductor wafers |
|
5,069,002 |
Apparatus for endpoint detection during mechanical planarization of
semiconductor wafers |
|
5,081,796 |
Method and apparatus for mechanical planarization and endpoint
detection of a semiconductor wafer |
|
5,234,867 |
Method for planarizing semiconductor wafers with a non-circular
polishing pad |
|
5,421,769 |
Apparatus for planarizing semiconductor wafers, and a polishing pad
for a planarization apparatus |
|
5,514,245 |
Method for chemical planarization (CMP) of a semiconductor wafer to
provide a planar surface free of microscratches |
|
5,871,392 |
Under-pad for chemical-mechanical planarization of semiconductor
wafers |
|
5,980,363 |
Under-pad for chemical-mechanical planarization of semiconductor
wafers |
|
6,048,256 |
Apparatus and method for continuous delivery and conditioning of a
polishing slurry |
|
6,056,630 |
Polishing apparatus with carrier head pivoting device |
|
6,083,838 |
Method of planarizing a surface on a semiconductor wafer |
|
6,702,654 |
Conditioning wheel for conditioning a semiconductor wafer polishing
pad and method of manufacture thereof |
|
RE34,425 |
Method and apparatus for mechanical planarization and endpoint
detection of a semiconductor wafer |
| Pending |
TI-36839 Method of Slurry Conditioning for CMP |
|
